Traces of dislocations analysis by TEM is a critical Material analysis. Since the dislocations may cause defects leading to leakage currents in IC…
SRAM failure analysis is challenging due to its dense, repetitive cell structure. However, its high-speed operation, low latency, and low power consumption make SRAM crucial for logic ICs, especially in AI applications…
TEM EDS light elements like carbon, nitrogen, and oxygen, does TEM/EDS compositional analysis become inaccurate? It turns out that…
Traces of dislocations analysis by TEM is a critical Material analysis. Since the dislocations may cause defects leading to leakage currents in IC…
Traces of dislocations analysis by TEM is a critical Material analysis. Since the dislocations may cause defects leading to leakage currents in IC…
As the semiconductor manufacturing process approaches its limits, materials analysis has become crucial for overcoming bottlenecks. In the industry, electron microscopes coupled with X-ray…