Tech Library Archives - Page 4 of 15 - iST-Integrated Service Technology

2024-09-09by ruby

Ensuring IC Reliability with Board Level Testing

AEC-Q100 REV A Quick Guide to AEC-Q100 Revision for Automotive Chip Reliability Verification

2024-09-06by ruby

A Quick Guide to AEC-Q100 Revision for Automotive Chip Reliability Verification

SiPh As we stand on the brink of this transformative shift from "electrical" to "optical," are you ready for this revolution?

2024-09-04by ruby

“Optical” Breakthrough: Silicon Photonics Chips Ready to Launch

space environmental testing By 2040, the global space economy is poised to shatter the $1 trillion mark, enticing a flurry of electronics manufacturers into the cosmic marketplace. However, when confronted with the rigorous challenges of rocket launches and the harsh confines of space, how does one orchestrate ground-based simulations to ensure the flawless operation of their products in orbit?

2024-08-15by ruby

From Ground to Space: The Rigorous Testing of Commercial Satellite Electronic Components

Blow up IC on Circuit board after Short Circuit

2024-08-05by 震豪SEO專用

Enhancing Semiconductor Reliability with Burn-in Boards

SRAM Failure Analysis Investigating the Root Causes of SRAM Failures in AI Applications

2024-08-01by ruby

Investigating the Root Causes of SRAM Failures in AI Applications

TEM EDS Calibration Although the standardless quantitative method simplifies the analysis process, light elements often lead to errors due to absorption effects. This article introduces a self-calibration technique that significantly improves the accuracy of analyzing oxides, nitrides, and similar materials by correcting EDS data through reference phases. The effectiveness of this method is demonstrated using a GaN thin-film case study.

2024-07-16by ruby

TEM EDS Analysis Inaccuracy Caused by Light Element Absorption

2024-07-05by 震豪SEO專用

Accelerated Reliability Testing: An Essential Guide

A close-up view of a circuit board under pink and blue lighting, illustrating the intricate components and design details involved in burn-in testing for electronic devices

2024-06-27by 震豪SEO專用

Maximizing Electronics Reliability Through Burn-in Testing

TEM EDS Calibration Although the standardless quantitative method simplifies the analysis process, light elements often lead to errors due to absorption effects. This article introduces a self-calibration technique that significantly improves the accuracy of analyzing oxides, nitrides, and similar materials by correcting EDS data through reference phases. The effectiveness of this method is demonstrated using a GaN thin-film case study.

2024-06-25by ruby

Intelligent Interpretation of True or False Signals in EM/EDS Analysis