Home The next century IC debug solution to break through the Moore’s law

The next century IC debug solution to break through the Moore’s law

Home The next century IC debug solution to break through the Moore’s law

The next century IC debug solution to break through the Moore’s law

by admin

ICs have been evolving for faster speed, lower power consumption, and least production cost. This is reflected in process technology in two aspects:

  1. The first is breaking the Moore’s Law from 28nm-16nm-10nm-7nm-5nm and further down to still smaller line widths.
  2. The second is lifting upward from 2D (plane) structure to stack chips into 2.5D or 3D hierarchy.

iST is ready to assist customers in dealing with product failures in both dimension. It assists customers to identify product failure mode and drill down root cause with professional consultancy and relevant analysis in shortest time.

In addition, iST has a world class verification zone to secure your sample products from any information leaks and hacks.

Launch speed of new IC products is determined by shortening the development schedule from assessment through design to mass production. In case there is circuit modification due to defects found in early design stage, iST may provide series of services including special sample preparation , employ the most advanced ,then verify testing again without replacing mask process to cut mass production schedule. Regarding reliability test ,iST also provide complete series of experiment program including quick assembly SMT test sample preparationBLR verification to control product quality.


In case of product failure (R&D or RMA) and requiring further analysis, iST’s comprehensive failure analysis platform is always ready to serve customers with: ultra-resolution 3D X-RaySAT, electric characteristics measurement and analysis like IV measurement for device feature comparison; defect spot positioning like Thermal EMMIInGaAsOBIRCH

All these combined with complete sample pre-processing technologies including IC decapIC delayercross-section & backside grindingion beam cross-section polishing (CP) along with high-resolution observation tools like field emission scanning(FESEM)dual beam FIB) may help customers to identify failure causes by step-by-step analysis.

Regarding material analysis, iST is capable of material micro structure analysis and nano-level surface ingredient analysis including Auger Electron Spectroscopy (AES) X-ray electron spectroscopy (XPS) transmission electron microscope (TEM) secondary ion spectroscopy (SIMS) as well as EDS and EELS ingredient analysis to meet material analysis requirements by customer.

Another goal aimed for by enterprises in implementing advanced IC process is to enter into the global electronics brands’ supply chain which mandates not only high product specification but also quality management, environment protection management and CSR. iST also meets these ends with its value-added services in total quality managementenvironment safety and health and CSR、and greenhouse gas water footprint tracking