iST presents you a hot defect detection device in non-destructive way: 3D X-ray. This hot hardware of zero-dead angle shooting and image surrounding has solved 1023 customer cases…
iST proposes 3 steps for selecting the failure analysis tools, so that the defect can be found and the true cause of failure can be identified…
Communication chips failed and the bug indicator tells there is a hot spot in existence. How to identify causes? Let us present two typical cases…
The 3D chip stacking technology for improved electronic product performance comes with its own problems, it’s much harder to pinpoint defects encountered…
A smart device screen fails to turn: is it a device failure or a component defect?If it’s a MEMS component defect: is it a leak, obstruction, or off-set? Most importantly, how do you pinpoint the cause?As a smartphone developer or MEMS components designer…
iST has upgraded its equipment stock with a ZEISS Xradia 520 Versa, a cutting-edge High Resolution 3D X-ray Microscope, for industry leading resolution…