What should you do to identify burnt areas in order to proceed with circuit design modification? The iST Tech Classroom presents some typical cases to help you pinpoint component EOS abnormal hot spots…
The iST Tech Classroom for this month is about finding ways to pinpoint IC package defects without damaging the sample itself. Step 1: Positioning, detect failure depth…
iST presents you a hot defect detection device in non-destructive way: 3D X-ray. This hot hardware of zero-dead angle shooting and image surrounding has solved 1023 customer cases…
iST proposes 3 steps for selecting the failure analysis tools, so that the defect can be found and the true cause of failure can be identified…
Communication chips failed and the bug indicator tells there is a hot spot in existence. How to identify causes? Let us present two typical cases…
The 3D chip stacking technology for improved electronic product performance comes with its own problems, it’s much harder to pinpoint defects encountered…