Communication chips failed and the bug indicator tells there is a hot spot in existence. How to identify causes? Let us present two typical cases…
Do you really have to break a 12″ wafer to measure its surface roughness? iST employs a Bruker Dimension ICON AFM…
The 3D chip stacking technology for improved electronic product performance comes with its own problems, it’s much harder to pinpoint defects encountered…
For best P/N identification, it is recommended to obtain its width and depth based on a clear SEM image and identify the position with colors by SCM…
Plasma FIB enables large scope observation to present the whole structure in the target area at etching speeds 20 folds faster than traditional DB FIB…
A smart device screen fails to turn: is it a device failure or a component defect?If it’s a MEMS component defect: is it a leak, obstruction, or off-set? Most importantly, how do you pinpoint the cause?As a smartphone developer or MEMS components designer…