Home Tech Library

Tech Library

How to Eliminate Underfill Voids with Vacuum Pressure Oven
2021-01-20

iST reliability lab introduces a vacuum pressure oven, which can prevent the underfill voids from affecting the reliability test results…

Learn About These Three Demands to Tackle the Challenges of the AI Chip Reliability Design
2020-08-11

Applying AI technology to the COVID-19 pandemic prevention is a hot topic now, how to apply AI in accurate pandemic prediction and prevention?

How to Monitor the Severity Level of Air Quality and Ensure Your Product Meet the Verifications of Compliance in ISA 71.04
2020-07-16

Customer requires that your product needs to meet the air quality standard of ISA 71.04 compliance for G2 or G3 level. How to face customers’ requirements…

Support Your SMT DOE Tests in Small but Various Batches When In-House SMT Lines Fully Occupied
2020-04-16

iST SMT assists you in SMT DOE tests and optimizes the combination parameters to solve SMT issues in R&D…

How to effectivity verify the creep corrosion failure occurrence on electronics?
2019-09-04

The IT equipment was easily affected by corrosive gases, moisture…Therefore, it is very important to verify the robustness against creep corrosion…

Face the Inevitable Test Failure. How to Solve Warpage Problem of Automotive Advanced Packages
2019-08-14

With booming IoV, the advanced packaging chip has been adopted overwhelmingly. But subsequent, how to solve Automotive advanced package warpage problem…