With booming IoV, the advanced packaging chip has been adopted overwhelmingly. But subsequent, how to solve Automotive advanced package warpage problem…
Warpage suffered by IC component may ramp up when SMT on PCBs due to different CTEs between ICs and PCBs. which, in turn, leads to poor reliability…
The semiconductor packaging tech is being advanced driven by booming self-driving car. Allan Tseng is here to share Automotive Testing to cope with new PKG…
To keep up with the demand for high-speed transmission, automotive semiconductor chips are growingly packaged in MCM/SiP assembly, instead of BGA…
Do you know what differentiates “industry spec” and “customer spec” in the automotive electronics industry? How to do tests at the smallest cost and…
Which standard, AEC-Q100 or ISO16750, should be employed for automotive tests by manufacturers of complex multichips like MCM and SIP? This year, problems that baffled IC design houses…