Electrochemical migration ECM takes place easily to cause short circuit in HAST. Is it a flux issue or the test environment issue? How can we prevent ECM in HAST ?
Do you know that PCB design is the key to pass or fail in broad level reliability tests?
How to interpret and use the values from HTOL and the resulting MTTF and Failure Rate (λ)? What are the differences between MTTF and MTBF?
Lenovo and Intel have been advocating LTS process since 2017. Why is it coming into our focus now and why is it required?Will this LTS be the mainstream of consumer products in years to come?…
The LTS technology not only saves energy and cuts carbon emission but also reduces failures and defects when soldering electronic components at high temperature…
Why need to verify sulfur corrosion occurrence on passive components? How to ensure the compliance for ANSI/EIA-977 standard?