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Marching Toward Carbon Neutrality via Low Temperature Soldering (LTS)
2021-11-30

The LTS technology not only saves energy and cuts carbon emission but also reduces failures and defects when soldering electronic components at high temperature…

How to verify the sulfur corrosion occurrence on passive components and compliance for ANSI/EIA-977 standard
2021-08-16

Why need to verify sulfur corrosion occurrence on passive components? How to ensure the compliance for ANSI/EIA-977 standard?

Reduce Warpage Deformation by Low Temperature Soldering Process
2021-07-26

Here comes the new method of Low Temperature Soldering (LTS) by the iST’s BLR lab to reduce level of warpage deformation with less thermal stress…

Latest Automotive Specifications Explore the Zero-Defect World of AEC-Q004
2021-02-23

Addressing zero defects, the first edition of AEC-Q004 guidelines has been released by AEC in 2020. This is a handbook aimed to supplement the specifications of AEC-Q100-104, and AEC-Q200…

How to Eliminate Underfill Voids with Vacuum Pressure Oven
2021-01-20

iST reliability lab introduces a vacuum pressure oven, which can prevent the underfill voids from affecting the reliability test results…

Learn About These Three Demands to Tackle the Challenges of the AI Chip Reliability Design
2020-08-11

Applying AI technology to the COVID-19 pandemic prevention is a hot topic now, how to apply AI in accurate pandemic prediction and prevention?