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Crystal Structures in Materials: The Key to Unbeatable Semiconductor Advanced Packaging
2023-05-16

When Moore’s Law reaches its limit, can advanced packaging be successfully developed? Master the crystal structure depends on the tool – EBSD…

New TEM Auto Metrology Helps Overcome 2nm Manufacturing Bottleneck
2023-04-13

TEM Auto Metrology, a precise and quick software newly developed by iST as an alternative to the traditional measurement methods. As manufacturing processes continue to shrink to 2nm, how to quickly and accurately measure parameters is a key to accelerate process development…

How to Identify & Analyze Ga2O3?
2023-01-10

This article is to show how to use TEM techniques to characterize the morphology, crystal structure, and composition of these gallium oxides..

XRD: Solution for verifying the characteristics of new materials in advanced processes
2022-09-13

In an advanced process, while stringent control to verify quality stability is required after materials selection and changes, how to verify the characteristics of new materials?

Key to heterogeneous integration: Materials Bonding Stress
2022-08-02

How to use analysis tools to verify the rheological characterization of materials underfill in heterogeneous component integration, as well as the strength of bonding strength of copper and dielectric materials…

Improvement of Advanced Process Defect through Materials Analysis
2022-05-26

While process equipment is the key to semiconductor yield, how to improve advanced process defects through materials analysis?…