IC die bonding process is one of key steps in semiconductor’s packaging process and its quality is critical to the capacity of entire packaging process…
The IT equipment was easily affected by corrosive gases, moisture…Therefore, it is very important to verify the robustness against creep corrosion…
With booming IoV, the advanced packaging chip has been adopted overwhelmingly. But subsequent, how to solve Automotive advanced package warpage problem…
Warpage suffered by IC component may ramp up when SMT on PCBs due to different CTEs between ICs and PCBs. which, in turn, leads to poor reliability…
The semiconductor packaging tech is being advanced driven by booming self-driving car. Allan Tseng is here to share Automotive Testing to cope with new PKG…
To identify failure of the single component which results in defective IC is a tall order. Internal wiring and board circuit connections among SiP, MCM, MCP, and QFP tends to suffer in electric tests by interference of other chips or device components which, in turn, makes test results hard or even impossible clear…