Warpage suffered by IC component may ramp up when SMT on PCBs due to different CTEs between ICs and PCBs. which, in turn, leads to poor reliability…
The semiconductor packaging tech is being advanced driven by booming self-driving car. Allan Tseng is here to share Automotive Testing to cope with new PKG…
To identify failure of the single component which results in defective IC is a tall order. Internal wiring and board circuit connections among SiP, MCM, MCP, and QFP tends to suffer in electric tests by interference of other chips or device components which, in turn, makes test results hard or even impossible clear…
3D X-ray are also ideal for non-destructive inspection over 3D IC, MEMS, and even PCB, PCBA, lithium battery/engineering Plastics…
To keep up with the demand for high-speed transmission, automotive semiconductor chips are growingly packaged in MCM/SiP assembly, instead of BGA…
As predicted by Moore’s Law, the IC process is continuously shrinking down to below 16 nm, as most of ICs package types are flip chip packages, backside…