As wearable applications thrive and lead the trend in the global technology industry, iST announces today (June 10, 2014) its formal engagement in solder joint reliability test services of wearable flexible print circuits (FPC), expecting to resolve reliability issues encountered by IC designers and FPC suppliers regarding wearable products, for ensuring the yield in chip assembly of wearable products…
HSINCHU, Taiwan, June 3, 2014 – iST, a leader in certification services of electronic products, today announced it entered into a Memorandum of Understanding (MoU) with Simplay Labs, the leading provider of standards compliance and interoperability testing services for consumer electronics (CE) and mobile devices, to give its customers access to the full suite of testing capabilities for HDMI® 2.0 (High-Definition Multimedia Interface), MHL® 3.0 (Mobile High-Definition Link), and HDCP 2.2 (High-bandwidth Digital Content Protection) enabled devices…
While the semiconductor industry continuously pursues 20/14 nm processes, iST joins in by enhanced its capabilities in Material Analysis…
Consumers’ high expectations for shock resistant smart phones are leading to ever more restrictive test standards for major international manufacturers for product quality assurance…
After being certificated by the international brand, Dell, Delphi, Continental, Lenovo, Cisco and hp in recent years, iST today (2013/10/17) announces the ESD lab of iST Shanghai was approved by Texas Instruments, and has received the orders from TI…
With the rapid and booming development of advanced technologies, MEMS devices have become the core of intelligent products…