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RICHTEK and iST jointly reveal collaboration results in MEMS G-Sensor Inspection
2015-01-09

RICHTEK Technology and iST jointly announced cooperation results in inspecting Micro Electro Mechanical Systems (MEMS) today (1/9)…

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iST unveil its 2nd gen MEMS analysis with unique “dynamic abnormality inspection”
2014-11-10

Amid MEMS components cored at smart devices, iST unveils its breakthrough MEMS inspection technology! In the wake of successful MEMS G-Sensor standard failure analysis process last year, which enabled up to over 90% MEMS developers in Taiwan, iST unveils its 2nd gen MEMS analysis with unique dynamic abnormality inspection (DAI), according to announcements revealed by iST today (11/10)…

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iST offers High-end equipment for Material and Failure Analyses, to cope with the demand of wearable products and 3D packages verification
2014-10-09

When wearable and mobile devices get more and more popular, electronic products are evolving into compact versions. Internal structure of products tends to be thinner and more compact, unprecedented limits are encountered for analyzing, measuring or observing product properties…

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iST becomes an official Simplay Labs ATC partner for HDMI® 2.0 & HDCP 2.2
2014-10-02

Leading electronic product certification service provider iST announces today (10/2) that earlier this month, Simplay™ Labs, LLC reviewed and approved our capabilities to conduct compliance testing for HDMI® 2.0 and HDCP 2.2, appointing iST as an official Simplay Labs ATC partner…

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iST release AE test method to assist telecom manufacturer prevent PCB material from pad cratering defect
2014-08-11

For ongoing telecom (4G/LTE and base station) and cloud computing era, global leading lab-service company- iST unveils Acoustic Emission Test (AE test) to evaluate the quality and reliability of Printed Circuit Board using on above field…

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iST develops exclusive G2 WLCSP circuit edit solution
2014-07-10

Walking always ahead of times and industries, lab service provider Integrated Service Technology (iST) never stops in technology R&D…

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iST steps into solder joint reliability test of wearable devices
2014-06-10

As wearable applications thrive and lead the trend in the global technology industry, iST announces today (June 10, 2014) its formal engagement in solder joint reliability test services of wearable flexible print circuits (FPC), expecting to resolve reliability issues encountered by IC designers and FPC suppliers regarding wearable products, for ensuring the yield in chip assembly of wearable products…

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iST Enters Into Strategic Alliance With Simplay Labs to Offer HDMI 2.0/MHL 3.0/HDCP 2.2 Testing
2014-06-03

HSINCHU, Taiwan, June 3, 2014 – iST, a leader in certification services of electronic products, today announced it entered into a Memorandum of Understanding (MoU) with Simplay Labs, the leading provider of standards compliance and interoperability testing services for consumer electronics (CE) and mobile devices, to give its customers access to the full suite of testing capabilities for HDMI® 2.0 (High-Definition Multimedia Interface), MHL® 3.0 (Mobile High-Definition Link), and HDCP 2.2 (High-bandwidth Digital Content Protection) enabled devices…

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A leap in MA Energy through high-end TEM installation& authority engagement Dr. Chung-Xing Bao
2014-05-12

While the semiconductor industry continuously pursues 20/14 nm processes, iST joins in by enhanced its capabilities in Material Analysis…

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