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Press Releases

Home Press Releases

Press Releases

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【Invited Lecture】ECTC 2017
2017-06-01

ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE, which is a world-top trade show of IC packaging technology…

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【Trade Show】ChipEx2017
2017-05-09

ChipEx2017, the largest annual event of the Israeli microelectronics industry, will be held in May 9-10, 2017 in Tel Aviv, Israel…

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【Paper Released】IPC APEX EXPO 2017
2017-02-11

From February 11 to 16, IPC APEX EXPO 2016 is held by IPC (Association Connecting Electronics Industries) in San Diego, USA…

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【Trade Show】Car-Ele Japan 2017
2017-01-18

iST will be participating as an exhibitor in the Car-Ele Japan 2017 on January 18-20 at Tokyo Big Sight, Japan. Our booth no. is E34-12, look forward to seeing you soon!

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【Trade Show】2016 IIT
2016-09-26

iST will be participating as an exhibitor in the IIT 2016 on September 26-30 at NCKU conference center, Tainan. We look forward to seeing you soon!

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【Trade Show】TSMC 2016 Open Innovation Platform Ecosystem Forum
2016-09-22

iST will be participating as an exhibitor in the upcoming TSMC 2016 Open Innovation Platform Ecosystem Forum on September 22nd at the San Jose McEnery Convention Center…

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【Paper Publish】ICEPT 2016
2016-08-18

The 17th International Conference on Electronic Packaging Technology (ICEPT) will be held in Wuhan, China on 16-19 August…

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【Trade Show】TSMC 2016 Technology Symposium
2016-06-13

iST will be participating as an exhibitor in the upcoming TSMC 2016 Technology Symposium & Open Innovation Platform™ Ecosystem Forum…

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