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PCB Industry
Printed circuit board (PCB or PWB) has been Mother to all electronic products. Recently, under the trend of miniature design and lead free processes, potential hazard of increased thermal stress in conventional PCBs escalates because either reflow soldering or wave soldering increases the working temperature; product failures caused by PCBs are more than the time when lead free process transferred. Although material suppliers have developed high Tg substrates or altered hardener types to overcome the thermal stress issue, new issues that rarely happened occur more.

Before the lead free issue in PCBA applications can be fully overcome, international organizations actively begin to promote application development of halogen free PCBs to cope with environmental requirements. This is a further mishap to the PCB industry. PCB attributes enabled evasion of total halogen control issues in the last transfer of RoHS, however, the current appeal for halogen free has created more obvious impacts to the industry.

The halogen free demand mainly addresses a reduction or a substitution of halogen content in flame retardant additives to the material. As recommended by international organizations, contents of chlorine (Cl) and bromine (Br) shall be each less than 900ppm or 1500ppm in combination. Nevertheless the lead free transfer aims to change solder materials while high-temperature assembly is an essential process. Under the need to sustain the high-temperature of lead-free process and to comply with halogen free requirements at the same time, the main alternative besides using substitute flame retardants, is commonly used by increasing filler proportion in the resin, to increase its heat resistance.

Due to changed properties of materials, main problems of halogen free PCBs include hardening and crisping effects, reduced bonding force of copper foil that leads to reduced pad bond strength, pool quality of drill holes due to material hardening, and an increase of wick effects. These problems lead to reduced time of Conductive Anode Filament (CAF), high-frequency instability and Pad Cratering, making people more concerned about the reliability of PCBA. Major international manufacturers take 2010 for initiating halogen free process. The process may have no big differences compared to lead-free, but the potential and actual risks in product durability may increase significantly. IST has developed tests for verifying halogen-free materials, which may be of help to the customer in carrying out preliminary verification of product durability or sampling analysis, assisting the customer to enter into mass production smoothly.

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PCB Industry Application category
Halogen-free PCB Reliability Test and Failure Analysis
PCB - Failure Analysis
PCB - Reliability Test
IC & MEMS Industry
IC Reverse Engineering
IC Verification
IC Failure Analysis
MEMS Failure/Reliability/Reverse Engineering
LED Industry
LED Verification for U.S. Energy Star®
LED LM-80 Test for Energy Star®
LED - Failure Analysis
LED - Reliability Test
Automotive Electronics
Failure Analysis of Automotive IC & Parts
Reliability Test of Automotive IC
Reliability Test of Automotive Materials
Environmental Chemical Analysis of Automotive Materials
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