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Failure Analysis

Service Items in Failure Analysis
Provide necessary equipment and resource for carrying out IC Component Failure Analysis, Electrical Failure Analysis (EFA), Physical Failure analysis (PFA) 
Provide of One-stop analysis services
Provide of third party report

Type of Failure Analysis services
Post-test failure analyses for ESD / Latch-up / OLT / Pre-condition /Reliability tests
Analytic services on RMA samples, and defect products.
Sample analysis after C/P , F/T or PCBA.



Non-destructive Analysis
Ultrahigh Definition Digital Microscope(3D OM)
Scanning Acoustic Tomography (SAT)
X-ray Inspection (2D X-ray)
BGA Solder Ball Joint Inspection
High Resolution 3D X-Ray Microscope
Electrical Characteristics Measurement
Keithley Parameter Analyzer
Auto Curve Tracer
Prober (Prober Station)
HP4156 Parameter Analyzer
TLP (Tranksmission Line Pulse)
Nano Prober
Defect Detection
Emission Microscopy (EMMI)
Optical Beam Induced Resistance Change (OBIRCH)
Thermal EMMI (InSb)

Competitive Analysis
Digital Photos
Packaging Reverse Engineering
IC Reverse Engineering
IC Cost Analysis

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