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Failure Analysis
 

Service Items in Failure Analysis
Consultation
Provide necessary equipment and resource for carrying out IC Component Failure Analysis, Electrical Failure Analysis (EFA), Physical Failure analysis (PFA) 
Provide of One-stop analysis services
Provide of third party report

Type of Failure Analysis services
Post-test failure analyses for ESD / Latch-up / OLT / Pre-condition /Reliability tests
Analytic services on RMA samples, and defect products.
Sample analysis after C/P , F/T or PCBA.

 

 

Non-destructive Analysis
Scanning Acoustic Tomography (SAT)
X ray inspection (2D X-Ray)
BGA Solder Ball joint inspection
3D X-ray CT Inspection
Electrical Characteristics Measurement
Time Domain Reflectometer (TDR)
Keithley Parameter Analyzer
Auto Curve Tracer
Prober (Prober Station)
HP4156 Parameter Analyzer
TLP (Tranksmission Line Pulse)
Nano prober
Defect Detection
Emission Microscopy (EMMI)
InGaAs EMMI
Optical Beam Induced Resistance Change (OBIRCH)

Competitive Analysis
Digital photos
Packaging reverse engineering
IC reverse engineering
IC Cost Analysis
  

 
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