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Engineering Sample Preparation

The Engineering experiment and analysis are successful or not that is highly dependent on the related sample preparation.

For board-level solder joint reliability verification, a good SMT process is necessary; for IC failure analysis, a good decapsulation and delayer process is necessary too. According to failure analysis of IC, PCB and some specific material, the cross-section technology and sample preparation of TEM inspection play an important role on the precisely identifying the related failure location.


PCB Services
Emulation Board
Demo board
Test Board
Modular Boards
System Boards
Quick-term Assembly
Wafer Dicing Service
IC Wire Bonding Service
IC Packaging and Integration
IC Decapsulation
IC Decapsulation

IC Delayer
IC Delayer Process
Cross-section Process
Cross-section Inspection
Ion Beam Cross-section Polisher (CP)
IC Backside Polishing
Surface Mount Technique (SMT)
Surface Mount Technique (SMT)

Dual-beam FIB
Dual-beam FIB Sample Preparation

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