Contact IST  Home 繁體  簡中  Japanese
 
 
 
 
 
 
 
 



Reliability Test
 

Topnotch Technology with Full Services

The IST Reliability Engineering Division was established by a team from the Industrial Technology Research Institute. We provide complete environmental and reliability testing services from component level to module and systems level. Our laboratories are the nation's finest and expertized with a widespread of professional reliability technical service. Although reliability testing results are based on quanitative data, IST possesses strong Failure Analytic Technologies to enhance the ability to improve a product's reliability. Therefore, we not only provide a comprehensive reliability service platform, but also services to facilitate the component/ subsystems/ systems level process DOEs as well as failure analysis and reliability verifications.

Fast Service and Excellent Quality

IST Reliability Engineering Division has all the verification testing hardware that the industry needs to provide customers with rapid testing service completion times. We have received certifications such as ISO9000, ISO/IEC17025, and TAF(CNLA)17025 as well as many other certifications from international companies such as DELPHI, DELL, Cisco, Hp, etc.

 

System / Module Reliability Engineering
Thermal Cycling Aging Test
Corrosion Test
Noise Test
Testing the Storage Environment
Sand/ Dust and Rain Tests
Vibration and Mechanical Shock Test
Highly Accelerated Life Test - HALT
Damage Boundary Curve (D.B.C) Test
Fan Reliability Test
Climatic Environmental Test
Temperature and Humidity Testing (Damp Heat Test)
Dry Heat Test
Low Temperature Test
Walk-in Chamber
Temperature Cycling Test / Thermal Shock Test
Temperature and High Altitude (Low Air Pressure) Test
Salt Spray Test
Fibrous Dust Test
Dynamic Environmental Test
Vibration Test
Mechanical Shock Test
Bump Test
Loose Cargo-Bounce Test
Drop Test
Earthquake Test
Package Compression Test

Industries/Outdoor Environmental Test
Sand/ Dust/ Rain/ Water Immersion
Solar Test
Gas Corrosion Test
Wind Speed Test
Mechanical Stress Test
Push/ Pull Test
Bending Test
Twist Test
Connector Life Test
Dye/ Pry Test
Design Verification
Fan Reliability Test
HALT/ HASA/ HASS
Shock Fragility(Damage Boundary Test)
Reliability Demonstration(MTBF)
Acoustic Test
Component on Board Reliability Qualification

Lead Free Qualification
Lead-free Reliability Introduction
Lead-free Assembly Quality Inspection
Lead-free Part Reliability Test
PCBA/ System Level Reliability
Component Reliability
High-temperature / High electric field induced Gate Leakage Test
Heat Resistance and Solderability Test
Thermal Shock Test (Gas / Liquid)
Press Test
Moisture Sensitivity Level Test
IC Operation Life Test
IC Reliability Qualification Board Assembly
IC ESD Protection Test and Latch-up Test
Highly Accelerated Stress Analysis
Components Precondition
Components Vibration Test
Components Mechanical Shock Test
BGA Solderability Test
Halogen-free PCB Reliability Test
Understanding Halogen-free Process
Halogen-free PCB Reliability Test and Failure Analysis

Board Level Reliability Test
Component on Board Reliability Analysis (2nd Level RA)
Component on Board Failure Analysis (2nd Level FA)
Other Test
European Telecommunications Reliability Test
Automotive Electronics Reliability
Environment Stress Screening (ESS)
Systems/ Module Electrostatic Discharge
Challenges facing the medical electronics industry in 2014
 

 
China      |       Japan     |        US       |       TWN Standard     |       TWN Advanced      |       Partnerships
Designed by CREATOP