FIB is capable of making signal retrieving probe gads in an IC. Using FIB, points where signals must be measured are led to the surface of the IC so that a Mechanical prober may retrieve internal signals in IC.
When measuring IC signals with a Mechanical prober, the IC is placed on a test board for necessary voltage conditions. In general, signals inside the IC are weak and they are insufficient to drive the combined load of lead wires and oscillator, resulting in issues such as square waves deformed into triangular waves and reduced DC levels. These problems can be improved by way of Active Probing.