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Non-destructive Analysis
Electrical Characteristics Measurement
Defect Detection
Competitive Analysis

IC Cost Analysis
This is an engineering analysis includes structure, material and process technologies of IC chips. IST’s engineering teams not only have rich experiences in different ICs such as Memory IC, Logic IC and Power management IC, but also develop capacities for analyzing MEMS, HV IC, CIS and other special ICs. We also provide complete and customized analyses.

Service include:
   Package Analysis : Package type/ material, External appearance, Internal structure inspection.
   Physical Structure : Die appearance, Process node, Material analysis, Specific structure analysis.
   IC Macro Analysis : Functional block ration, Memory type confirm, Memory capacity.
Example photo                                                                              
IC structure、IC cost analysis、structure analysis
Please contact nearest location for inquiries :
USA Taiwan ─ Hsinchu China ─ Shanghai Kunshan Beijing Shenzhen Japan
Other services you may be interested in:
Digital Photos
Packaging Reverse Engineering
IC Reverse Engineering
Cross-section Inspection

Lab Service:    Taiwan      |       China      |        USA       |       Japan     |       TWN ITS     |       Partnerships
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