|This is an engineering analysis includes structure, material and process technologies of IC chips. IST’s engineering teams not only have rich experiences in different ICs such as Memory IC, Logic IC and Power management IC, but also develop capacities for analyzing MEMS, HV IC, CIS and other special ICs. We also provide complete and customized analyses.
Package Analysis : Package type/ material, External appearance, Internal structure inspection.
Physical Structure : Die appearance, Process node, Material analysis, Specific structure analysis.
IC Macro Analysis : Functional block ration, Memory type confirm, Memory capacity.