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Packaging Reverse Engineering
 

This service aims at reverse engineering of PCB layout and IC packaging. The analysis report consists of layer layout of PCBs and relevant structure and material of IC packages together with accurate dimensions. IST also provides comprehensive analyses in aspects of costs, man-hours, man-power, and technologies concerning the sample, to help the customer speed up product development.

Services include:
   PCB Layout /Circuit Reverse
   Package Physical Layer /Circuit Reverse
   Pin/Pad Mapping

PCB Layout via reverse engineering analysis
 
 
 

 

reverse engineering、reverse、circuit extraction
黃先生/Chunan
+886-3-5799909#8201
web_reverse@istgroup.com
Please contact nearest location for inquiries :
USA Taiwan ─ Hsinchu China ─ Shanghai Kunshan Beijing Shenzhen Japan
Other services you may be interested in:
 
IC Reverse Engineering
IC Cost Analysis
Digital Photos
 


 
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