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Non-destructive Analysis
Electrical Characteristics Measurement
Defect Detection
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X-ray Inspection (2D X-ray)

An X-Ray is produced using a cathode ray tube to generate high energy electrons to collide with a metal target. The energy of the electrons is converted into X-Ray during the collision with metal target. The X-Ray has very short wave length and high electromagnetic radiation.

When the sample location cannot be inspected using external appearance related metrology tools, X-Ray imaging can be used to detect the internal structure of the sample due to its intensity change as a function of material density. This contrast image can show the internal structure of the sample without any physical destruction to the diagnosed region.

Major application:
   Defect inspection in IC packaging﹕layer delamination, burst Crack, void, and bonding inspection. 
   Potential defects in the PCB manufacturing process e.g.: mis-alignment, bridge or open circuit. 
   SMT solding void inspection and measurement. 
   Defect inspection of open, short or abnormal connections in the interconnect. 
   Solder ball array inspection in BGA packaging and flip chip packaging.
   Inspection of crack in high density plastic material or void in metal.
   Chip dimension measurement, wire arc measurement, solding percentage measurement.

Equipment limitation:
   Aluminum wires or low density materials used in IC packaging are not applicable to X-Ray inspection.

Machine appearance / model type ﹕
Dage XD7600 NT 250 

Spec / Feature﹕
Real time image
Measurement image dimension
Max magnification of 1920 (dipending on sample size)
X-Ray spot size:0.25μm
Tilt angle 66゚, 360゚rotation
Maximum energy 160KV, 3W
Inspection area 45cm (L) x 40cm (W) x 10cm(H) / weight 5kg

IC – detachment of second bond pad
IC – crack in second bond pad
IC – wire damage

BGA - solder rejection
BGA - solder short

PCBA – poor soldering of through hole
PCB - internal circuit crack
Passive divice
Passive divice - inductor metal layer open

x-ray、3D x-ray、void
Please contact nearest location for inquiries :
USA Taiwan ─ Hsinchu China ─ Shanghai Kunshan Beijing Shenzhen Japan
Other services you may be interested in:
Scanning Acoustic Tomography (SAT)
BGA Solder Ball Joint Inspection
High Resolution 3D X-Ray Microscope
Ion Beam Cross-section Polisher (CP)
Scanning Electron Microscope(SEM)
Dual-beam FIB

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