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Cross-section Process
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Cross-section Inspection

Sample cross-sectioning is a destructive experiment. By way of sandpaper (or diamond dust sand paper) milling and continuous polishing, a clear cross-section of the sample can be seen. It is a very quick way for preparing a sample. Combined with equipment like (Optical Microscope or SEM), we can observe structural cross-sections of samples. Besides to observing structure of ICs, observation of other samples such as PCB, PCBA or LED can also be made possible by cross-sectioning.

Basic process flow of sample cross-sectioning:
   Cutting: Cut sample into proper sizes using a cutter
   Cold fill: Fill filler mixture into gaps of sample to enhance structural strength of the sample, so that the sample is not damaged by the milling stress
   Milling: mill the sample with different sand paper (or diamond dust sandpaper)
   Polish: Polish with a turntable added with proper polishing liquid to eliminate fine scratches resulting from milling.

   IC products, such as Flip Chip, Al/Cu process structure, C-MOS Image Sensor
   PCB/PCBA product
   LED product

Machine specification / limits:
Cross-section machine: SBT-900

Sample cross-section-Example photo
Die Cross-Section
C-MOS Image Sensor
Sample cross-section-Example photo
Cu process Cross-section
Bump Cross-section
cross section、X-S、cross sectional
Please contact nearest location for inquiries :
USA Taiwan ─ Hsinchu China ─ Shanghai Kunshan Beijing Shenzhen Japan
Other services you may be interested in:
IC Backside Polishing
Scanning Electron Microscope(SEM)
Dual-beam FIB
IC Reverse Engineering

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