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IC Decapsulation
 

Principle of task:
Chemical etching decapsulation: A portion of proper area and depth of the IC packing is removed by chemical etching to expose the internal bonding and dies, without damaging or altering IC’s original electrical characteristics.

Laser etching decapsulation: Removing plastic IC packing with laser etching can achieve more precise positioning than chemical etching. If used in combination with chemical etching, yield rate can be improved due to reduced contact time with chemicals.

Applications:
IC decapsulation is normally used as the first step of an analysis; and its further analysis can be the appearance inspection, delayer process, FIB, EMMI/OBIRCH, and wire bonding, etc.

Chemical Etching decapsulation: Nisene Auto decap
 
 
 
Laser Etching : FATcat Laser decap
 
 
 

Laser Decap in combination with SEM inspection of second bond pads
IC – Detachment of second bonding pads
 
IC – second bond pad open
decap、decapsulation、compound removal
吳先生/Puma
+886-3-5799909#6731
web_decap@istgroup.com
Please contact nearest location for inquiries :
USA Taiwan ─ Hsinchu China ─ Shanghai Kunshan Beijing Shenzhen Japan
Other services you may be interested in:
 
FIB Circuit Edit
Cross-section Inspection
Emission Microscopy (EMMI)
InGaAs EMMI
Optical Beam Induced Resistance Change (OBIRCH)
Packaging Reverse Engineering
 


 
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