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Board Level Reliability Test
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Component on Board Reliability Analysis (Board Level RA)
The advance IC-on-board technology has developed gradually from BGA, QFN and QFP to the more high-end WLCSP, CSP, SoC and SiP processes, resulting in many changes in reliability qualification. IST offers extensive tests for component on board reliability qualification ranging from selection of criteria →PCB Layout / PCB production → SMT assembly → Quality Inspection to Reliability Qualification, such as temperature cycling test (TCT), mechanical shock test, vibration test, bending test, push/pull test, etc. Based on its rich experiences in IC and system reliability qualification, IST is capable of delivering complete service of component on board reliability qualification.

Example Photo
Temperature cycling test
Static/ Dynamic bending test
   Push/ pull test
second level、board level、daisy chain
Please contact nearest location for inquiries :
USA Taiwan ─ Hsinchu China ─ Shanghai Kunshan Beijing Shenzhen Japan
Other services you may be interested in:
Component on Board Failure Analysis(Board Level FA)
Component Pre-condition
Component Mechanical Shock Test
Component Vibration Test
Ion Beam Cross-section Polisher (CP)
Dye/ Pry Test

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