Almost 40% of IC assembly are found having delamination in Pb-Free Assembly; Moisture Sensitivity Level Test is introduced to verify moisture sensitivity level of ICs, for avoiding shortened lifespan or damage resulting from IC delamination in storage stage, SMT Assembly and final utilization.
According to IPC/JEDEC J-STD-020, the classification levels are defined into two categories: Sn-Pb Eutectic Assembly and Pb-Free Assembly. Moisture sensitivity level can vary greatly depending on the moisture conditions of the component, ranging from Level 1 to Level 6.
IPC/JEDEC J-STD-020D identifies failures according to apparent damages, electrical failures and internal cracks. For the position and ratio of delamination, two categories are defined: traditional Leadframe packing and Substrates; Details are defined in Sections 6.1 and 6.2. In case the selected moisture sensitivity level fails the test, less strict conditions can be used for re-test. The final level identification shall be indicated on the outer package for user control.
Moisture Sensitivity Level Test