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Push/ Pull Test
 

Push/Pull Test
Measuring the strength of solder joints and inspecting its failure mode, the test aims to analyze interacting factors that may influence the strength of PCB substrates and solder materials, the solder temperature curve and part materials

Machine information
    Brand: RHESCA
    Model: STR-1000
    Specifications: Max. thrust up to 20 kg; max. tension up to 5 kg

Standards 
    JIS Z 3198-6 / JIS Z3198-7 
    EIAJ ED 4702
    IEC60068-2-21

Solder Joint Test
 
 
 
 
push/pull、terminal strength、solder joint
陳先生/Alex
+886-3-5799909#6409
web_BLR@istgroup.com
Please contact nearest location for inquiries :
USA Taiwan ─ Hsinchu China ─ Shanghai Kunshan Beijing Shenzhen Japan
Other services you may be interested in:
 
Thermal Cycling / Shock Test
Lead-free Assembly Quality Inspection
PCBA/ System Level Reliability Test
 


 
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