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Bump Test
 

Bump Test
The purpose of this test is to verify the product's ability to withstand repeated force stress during transportation. This is usually conducted either packaged or unpackaged and simulates the repeated tossing or dramatic shifting and bumping based on distance, road status, type of transportation vehicle, tow truck, and so on. These factors are combined into different cycles which can be complex and random.

Bump test procedure: The test axes and orientation should be as close to the real environment as possible; IEC recommends vertical direction as preference and conducted on three axes (six faces). The number of bumps on each face should be based on standards; IEC recommends 1~3 bumps per second.



Testing of automotive electronics is based on its installation in the automobile. Many larger companies require 50,000 bumps or 100,000 bumps. Figure 2 is the USO-16750 standard for automotive electronics shock and bump testing.


Bump Test
 
 
 
bump、repeated shock、ISO 16750
陳先生/Injel
+886-3-5795766#7209
web_SRE@dekra-ist.com
Please contact nearest location for inquiries :
USA Taiwan ─ Hsinchu China ─ Shanghai Kunshan Beijing Shenzhen Japan
Other services you may be interested in:
 
Vibration Test
Mechanical Shock Test
Drop Test
Damage Boundary Curve (D.B.C) Test
Component Mechanical Shock Test
 


 
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