The purpose of this test is to verify the product's ability to withstand repeated force stress during transportation. This is usually conducted either packaged or unpackaged and simulates the repeated tossing or dramatic shifting and bumping based on distance, road status, type of transportation vehicle, tow truck, and so on. These factors are combined into different cycles which can be complex and random.
Bump test procedure: The test axes and orientation should be as close to the real environment as possible; IEC recommends vertical direction as preference and conducted on three axes (six faces). The number of bumps on each face should be based on standards; IEC recommends 1~3 bumps per second.
Testing of automotive electronics is based on its installation in the automobile. Many larger companies require 50,000 bumps or 100,000 bumps. Figure 2 is the USO-16750 standard for automotive electronics shock and bump testing.