Home Tech Library

Tech Library

Home Tech Library

Tech Library

by admin
Face the Inevitable Test Failure. How to Solve Warpage Problem of Automotive Advanced Packages
2019-08-14

With booming IoV, the advanced packaging chip has been adopted overwhelmingly. But subsequent, how to solve Automotive advanced package warpage problem?

Count Warpage Amount Before SMT to Avoid Solder Empty and Early Failure
2019-08-05

Warpage suffered by IC component may ramp up when SMT on PCBs due to different CTEs between ICs and PCBs. which, in turn, leads to poor reliability…