iST Reports May 2026 Revenue of NT$386 Million

Hsinchu, Taiwan, June 10, 2026 — Integrated Service Technology Inc. (iST, TWSE: 3289), a leading provider of electronic product verification and analysis services, today announced its consolidated revenue for May 2026, which totaled approximately NT$386 million. It is worth noting that starting from last month, iST’s affiliate, ProPowertek, has been recognized under the equity method and is no longer included in the consolidated revenue.

This change reduced part of the revenue scale base, leading to a base-period adjustment effect on the overall revenue structure. Nevertheless, under this new baseline, iST’s May revenue still achieved both month-on-month (MoM) and year-on-year (YoY) growth, demonstrating that its core business continues to maintain robust growth momentum, driven by strong demand in AI, silicon photonics, and advanced processes.

Recently, the global semiconductor industry has continued to accelerate its deployment of AI infrastructure. Several leading international chip and computing platform manufacturers have successively released next-generation AI computing architectures and product roadmaps, while simultaneously expanding investments in advanced packaging and high-performance computing (HPC).

On the other hand, a major foundry also pointed out in its latest technology symposium that future semiconductor competition will further extend from advanced processes to advanced packaging and system integration. This indicates that the industry is moving toward heterogeneous integration architectures with higher performance, higher density, and greater complexity. Key technologies, including Chiplets, High Bandwidth Memory (HBM), 3D stacking, Hybrid Bonding, and silicon photonics, have all become essential cores driving continuous breakthroughs in AI computing performance.

As AI chips widely adopt technologies such as Chiplet architecture, HBM, advanced packaging, and silicon photonics, the difficulty of product development and verification increases synchronously. From wafer manufacturing and packaging integration to high-speed transmission interfaces, every stage requires more comprehensive Material Analysis (MA), Failure Analysis (FA), and Reliability Assurance (RA) to ensure product quality and mass production stability. In particular, the rapid proliferation of advanced packaging and heterogeneous integration architectures has made verification and analysis an indispensable and vital link in the semiconductor development process, further driving up related market demands.

iST stated that the company has long been deeply engaged in key technological fields such as advanced processes, advanced packaging, silicon photonics, and reliability verification, continuously assisting global semiconductor and electronics industry customers in accelerating product development and ensuring product quality. In recent years, the company has also actively invested in establishing verification and analysis capabilities for AI chips, advanced packaging, and silicon photonics, while continuously deepening cooperation with the international semiconductor supply chain. As demand for AI, High-Performance Computing (HPC), and next-generation communication applications continues to heat up, it will drive steady growth in related verification and analysis demands.