Home iST’s Wafer Backend Process is Now IATF 16949 Certified

iST’s Wafer Backend Process is Now IATF 16949 Certified

Home iST’s Wafer Backend Process is Now IATF 16949 Certified

iST’s Wafer Backend Process is Now IATF 16949 Certified

by yuting

Issued Date: 2019/5/2
Issued By: iST

iST announced today (May, 2, 2019) that its wafer backend process fab (Hsinchu Science Park Building 2, hereinafter referred as “HSP Building 2”) is now IATF 16949:2016 automotive quality management system certified by third parties. Accredited with the IATF 16949 LOC (Letter of Conformance) for HSP Building 2, iST is qualified and capable of tendering items for the automotive supply chain.

With the development of Internet of vehicles (IoV), advanced automotive electronics products have become the major trend of development in recent years, and grab the semiconductor industry’s attention. Power semiconductors are mandatory components of automotive electronics and electric cars, following batteries, they account for the second largest share of automotive costs.

In current market, customers have run into a problem of short capacity of MOSFET. Thus, iST has decided to tap into the MOSFET wafer backend process field in 2018, a wafer thinning and surface process services between the foundry and packaging operations.

After taking efforts for more than one year, iST’s HSP Building 2 has officially acquired IATF 16949:2016 automotive quality management system certification. Established by the International Automotive Task Force (IATF), the IATF 16949 aimed at providing better products for global automotive makers and developing the automotive industry general requirements for quality management system.

In addition, accredited with the IATF 16949 LOC for HSP Building 2, iST is qualified and capable of tendering items for the automotive supply chain.

iST’s HSP Building 2 could provide not only services including Chemical Plating and Sputtering Deposition of Front Side Metallization (FSM), but wafer thinning (Backside Grinding & Backside Metallization, BGBM), so as to create an integrated solution for customers.

iST has had a professional operations team as well as comprehensive analysis capacity in the semiconductor verification and analysis business, and is committed to developing and providing qualify services. Marching from automotive reliability verification and analysis operation into wafer backend process and being certified with IATF 16949:2016 car quality management system qualification, iST is now blessed with development capabilities for wafer backend processes, to provide the process services required by supply chain of global car makers, and to be their entrusted partner, said William Cheng, the Senior Vice President of iST.

Founded in 1994, iST began its business from IC circuit debugging and modification and gradually expanded its scope of operations, including Failure Analysis, Reliability Verification, Material Analysis, Automotive Electronic Verification Platforms and Signal Integrity Testing Services. iST has offered full-scope verification and analysis services to the IC engineering industry, its customers cover the whole spectrum of the electronics industry from IC design to end products.

In response to iST’s mission of providing integrated solutions to customers, iST not only focuses on its core laboratory services but also enters the mass production services of wafer backend process. http://www.istgroup.com