Issued Date: 2014/11/10
Issued By: iST
Amid MEMS components cored at smart devices, iST unveils its breakthrough MEMS inspection technology! In the wake of successful MEMS G-Sensor standard failure analysis process last year, which enabled up to over 90% MEMS developers in Taiwan, iST unveils its 2nd gen MEMS analysis with unique dynamic abnormality inspection (DAI), according to announcements revealed by iST today (11/10). Thanks to DAI’s two generation more advancements than its competitors and adoptions by MEMS components designers and manufacturers, iST has enjoyed skyrocketing contracts awarded by customers.
MEMS developers are required to run reliability tests in the trial-production stage to ensure product quality, which is imposed of scores of failures caused by stiction, off-set, and structure damages, to name a few. In attempting to troubleshoot failures by identifying outliers in sample products, most MEMS would result in component contamination because of poor analysis methodology which, in turn, confuses product flaws and sample production process and makes the problem still murkier, as observed by iST.
In addition, the suspension structure of components is prone to damages when the external forces are removed. Both contribute more components contaminations and stress damages and lead to more false blind spots instead of pinpointed the true causes.
iST’s stress / contamination free standard analysis technology not only assists more than over 90% Taiwanese customers in clearing out failure factors at the design stage but also enables designers to assist wafer testers in identifying media layer load-out errors after MEMS wafers have been made, said xu, Ruhong, Failure Analysis Engineering Director of iST.
Mr. Xu further noted that iST has led the industry by debuting the 2-gen more advanced “MEMS stress free full mass block removal analysis skill” (see illustration ) along with unique dynamic/structure method. This not only can get precise error mode information without damaging MEMS, but also pinpoints causes to errors and removes them in fast pace by cross checking images pre- and post-MEMS sample production.
About Integrated Service Technology
Founded in 1994, iST began its business from IC circuit debugging and modification and gradually expanded its scope of operations to include failure analysis, reliability verification, material analysis, and quality assurance. Through the years, iST has constructed a comprehensive verification and analysis engineering platform, offering full-scope services to the IC engineering industry. iST customers cover the whole spectrum of the electronics industry from IC design to end products.
In response to rising environmental awareness, iST not only focuses on its core services but is also expanding its service offerings based on international trends. iST’s lead-free and halogen-free verification testing, chemical quantitative testing and signal integrity services have all been accredited by multiple international independent third-party organizations including TUV NORD Germany and BSI UK. With increased outsourcing by major international brands, iST now also plays the role of independent quality testing laboratory for OBM outsourcing products and is certified by Dell, Cisco, Delphi, Continental Automotive and Lenovo.
Headquartered in Hsinchu, iST’s pursuit of precision, perfection and efficiency has led it to expand its operations around the world. The iST Group now includes iST Kunshan, iST Shanghai, iST Beijing and iST Shenzhen in China, IC Service in Japan, and an iST laboratory in the US. These are all dedicated to providing customers with prompt, reliable and high-quality technical services in order to grow with the leaders of the world. For more information, please visit the iST website at: www.istgroup.com