iST escalates drop test scale for quality of unbreakable cell phones

Consumers’ high expectations for shock resistant smart phones are leading to ever more restrictive test standards for major international manufacturers for product quality assurance. iST Taiwan HQ has upgraded its drop/shock test capacity to meet highest specifications of major international cell phone makers, with a gravitation value reaching 10,000G.

iST has recently obtained numerous inquiries from IC Designer companies concerning this test item, which is expected to take grounds within supply chain of major manufacturers globally.

iST has observed that whenever a new cell phone is launched, in addition to performance tests, consumers inevitably scrutinize its durability to being dropped by carrying out drop tests. Test results are often quoted by web Forums as a key factor in cell phone quality.

Via simulation of a drop from a certain height, the Drop/Shock Test is the most commonly used method in the industry for testing the quality of handheld devices. In addition to examining the extent of the damage to the external panel, the test is more purposed to justifying internal solder joints that link IC components with PCBs, in terms of impact force (gravitational acceleration or G) and duration of impact (ms) , which are key factors representing lifespan of the product.

According to Allan Tseng, Director, Reliability Engineering Division of iST, IC components of handheld equipment nowadays are getting smaller and smaller while incorporating more functionalities. However, drop test specifications of international codes (JEDEC) used by supply chain members in the past had become inadequate for effective verification of the reliability of solder joints in miniature chips. They, therefore, were unable to satisfy the harsh definition of major international manufacturers – where increased impact test force (High G) and intensified number of cycle (or drops) are more often employed. For instance, one famous US cell maker long ago increased the impact force of drop tests to 10,000G from the 1,500G defined by JEDEC. A Korean cell maker has intensified the cycle of drops from 30 to 1,000.

Tseng further points out that major international makers define harsh drop test criteria not only for coping with miniaturized components in handheld products but also for incorporating merits of the System In Package (SIP) configuration. SIP modules of smart devices have the advantage of incorporating multiple IC devices in a single packet, thus the impact force sustained by solder joints between the IC & PCB connection is no longer the same as that in the previous packaging (ex: BGA). With these evolvements, multi-axis drop tests performed in various angles (front, side, rear) are therefore the new trend for quality tests.

iST points out that energy of drop/impact test provided by iST reaches 10,000G/0.2ms, which, in combination with multiple-axis configuration, should be adequate in satisfying strict requirements of high reliability tests pursued by major international makers, making sufficient preparation for IC Designers to match potential criteria for working with international manufacturers. They thereby have become the most important partner of their customers in test and certification.

If you have inquiries regarding High G drop tests, please call Brian Wang at +886-3-579-9909 ext. 8886

About the iST Group

Founded in 1994, iST began its business from IC circuit debugging and modification and gradually expanded its scope of operations to include failure analysis, reliability verification, material analysis, and quality assurance. Through the years, iST has constructed a comprehensive verification and analysis engineering platform, offering full-scope services to the IC engineering industry. iST customers cover the whole spectrum of the electronics industry from IC design to end products. In response to rising environmental awareness, iST not only focuses on its core services but is also expanding its service offerings based on international trends. iST’s lead-free and halogen-free verification testing, chemical quantitative testing and carbon footprint/greenhouse gas inventory services have all been accredited by multiple international independent third-party organizations including TUV NORD Germany and BSI UK. With increased outsourcing by major international brands, iST now also plays the role of independent quality testing laboratory for OBM outsourcing products and is certified by Dell, Cisco, Delphi, Continental Automotive and Lenovo.

Headquartered in Hsinchu, iST’s pursuit of precision, perfection and efficiency has led it to expand its operations around the world. The iST Group now includes iST Kunshan, iST Shanghai, iST Beijing and iST Shenzhen in China, IC Service in Japan, and an iST laboratory in the US. These are all dedicated to providing customers with prompt, reliable and high-quality technical services in order to grow with the leaders of the world. For more information, please visit the iST website at:www.istgroup.com查詢。