Date: September 9–10, 2026
Venue: Antwerp, Belgium
Integrated Service Technology (iST) was invited to attend the 3rd Taiwan–Europe Chip Innovation Forum (TECIF 2026), held in Antwerp, Belgium, on September 9–10. Jointly organized by the National Institutes of Applied Research (NIAR) and imec, this premier event convened leading figures from academia, research institutions, and industry across Taiwan and Europe to explore breakthrough technologies, strategic R&D initiatives, and global talent exchange.
TECIF 2026 centered on expanding the next-generation semiconductor ecosystem, addressing critical topics including advanced process nodes, heterogeneous integration, advanced packaging, silicon photonics (SiPh), smart sensing, compound semiconductors, and emerging 2D/oxide materials. The forum brought together top academic institutions—including National Taiwan University, National Tsing Hua University, National Yang Ming Chiao Tung University, and National Cheng Kung University—alongside prominent Taiwanese industry leaders such as TSMC, UMC, Andes Technology, Himax, Artilux, and iST. Together with European research powerhouses and industry pioneers like imec and ZEISS, participants engaged in high-level discussions to unlock new frontiers in cross-continental technology deployment.
Representing iST, AVP Dr. Kim Hsu and Engineering Manager Dr. Ching-Chun Lin attended the forum. Dr. Lin delivered an address during the Industry Session on September 9, titled “From MPW (Multi-Project Wafer) Wafer to Silicon Validation.” The presentation highlighted engineering hurdles and pragmatic methodologies in taking chips from multi-project wafer runs through full-spectrum silicon verification, underscoring iST’s comprehensive technical roadmap across reliability assurance, failure analysis (FA), and materials analysis (MA).
As the rapid evolution of artificial intelligence, high-performance computing (HPC), and heterogeneous architectures drives semiconductor complexity, seamless cross-border integration—spanning IC design, foundry fabrication, and characterization—has become indispensable. iST remains committed to strengthening its advanced verification and testing capabilities, serving as a trusted catalyst bridging cutting-edge R&D with commercial reality alongside global ecosystem partners.