Date: July 14–16, 2026
Venue: Marina Bay Sands Expo & Convention Centre, Singapore
Integrated Service Technology (iST) participated in the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2026) in Singapore, engaging with semiconductor professionals, customers, and industry partners from around the world to exchange insights on the latest developments in AI, high-performance computing (HPC), advanced packaging, and reliability engineering.
At the exhibition, iST highlighted its Test Interface Solutions, including Burn-in Boards (BIB) and IC Engineering Substrates, along with a range of customized test interfaces and validation solutions. These exhibits demonstrated iST’s integrated capabilities spanning test requirements, hardware design, and validation analysis, helping customers address increasingly complex testing and validation challenges driven by high-power, high-speed, and high-reliability applications.
Throughout the event, the iST team also shared its expertise in Failure Analysis (FA), Material Analysis (MA), Reliability Testing, and test interface design with customers and industry partners, exploring evolving validation requirements across AI, automotive electronics, and advanced packaging applications. With its comprehensive technical capabilities, iST continues to help customers enhance product quality, reliability, and development efficiency.