Date: May 27–28, 2026
Location: Orlando, Florida, USA
Integrated Service Technology (iST) participated in the Electronic Components and Technology Conference (ECTC 2026) in the United States, joining industry leaders and technology experts from around the world to explore the latest developments in advanced packaging, heterogeneous integration, high-performance computing (HPC), and AI-driven applications.
Recognized as one of the premier conferences in the field of electronic packaging and assembly, ECTC brings together professionals from IC design, wafer manufacturing, semiconductor packaging and testing, equipment suppliers, material providers, and research institutions. This year’s conference highlighted key industry topics including chiplet architectures, 2.5D/3D packaging, Co-Packaged Optics (CPO), advanced thermal management technologies, and high-speed/high-frequency applications, reflecting the growing demand driven by AI, HPC, and next-generation data infrastructure.
Throughout the event, iST engaged with industry partners worldwide, sharing expertise in Failure Analysis (FA), Reliability Assessment (RA), Material Analysis (MA), High-Speed Signal Validation, and Test Interface Solutions. Discussions focused on the quality and reliability challenges associated with advanced packaging, high-performance computing, automotive electronics, and emerging semiconductor applications.
As semiconductor devices continue to become more sophisticated, higher standards for quality and reliability are required throughout the product lifecycle—from design verification and process development to volume production. As an independent third-party laboratory, iST remains committed to integrating testing, analysis, and validation capabilities to help customers accelerate product development, reduce risks, and improve product quality and competitiveness.
Looking ahead, iST will continue to participate in global industry events and technical exchanges, working closely with partners to support innovation and accelerate the commercialization of next-generation technologies.