Home Press Releases 【Event News】iST to Exhibit at EPTC 2025 – Electronics Packaging Technology Conference

【Event News】iST to Exhibit at EPTC 2025 – Electronics Packaging Technology Conference

Date: December 2–5, 2025

Venue: Singapore

iST is pleased to announce our participation in EPTC 2025, taking place at the Resorts World Convention Centre in Singapore from December 2–5, 2025.
Organized by IEEE, EPTC is one of Asia’s leading international platforms for innovation in advanced packaging, materials technologies, electrical design, and reliability engineering.

At Booth No. 12, iST will showcase our comprehensive one-stop capabilities spanning:

  • Packaging Validation

  • Material Analysis

  • Reliability Testing

  • Failure Analysis

  • Hardware Solutions, including test fixture design and customized hardware support for electrical and packaging-level evaluations

We will also highlight our extensive expertise in Advanced Packaging and Heterogeneous Integration, addressing industry challenges through integrated engineering solutions that accelerate development and enhance product robustness.

With multidisciplinary laboratory resources and a global technical footprint, iST continues to support customers worldwide in advancing next-generation packaging technologies, improving reliability performance, and optimizing hardware design for testing and system integration.

★ Date : December 2–5, 2025

★ Location : Resorts World Convention Centre