Date: November 25 (Tue), 2025
Venue: Amsterdam, Netherlands
iST was invited to participate in the 2025 TSMC Europe Open Innovation Platform® (OIP) Ecosystem Forum, held at the Hilton Amsterdam Airport Schiphol in Amsterdam, the Netherlands.
This year’s forum centered on AI-driven design innovation and cross-domain collaboration, focusing on AI, High-Performance Computing (HPC), Heterogeneous Integration, and Advanced Packaging. It gathered leading experts and ecosystem partners to exchange insights on next-generation semiconductor design, manufacturing, and packaging technologies.
As a trusted partner in semiconductor verification and analysis, iST engaged with global participants to share our integrated capabilities in Packaging Validation, Material Analysis, Reliability Testing, and Failure Analysis. With strong engineering expertise and an international lab network, iST continues to help customers accelerate product development, enhance design reliability, and strengthen collaboration across the semiconductor supply chain.
The European OIP Forum once again highlighted the global synergy and innovation potential of the semiconductor ecosystem under the AI revolution. iST remains committed to advancing semiconductor reliability with Professionalism, Speed, and Depth.
★ Date : November 25 (Tue)
★ Location : Hilton Amsterdam Airport Schiphol