Date: November 18 (Tue) – November 19 (Wed), 2025
Venue: Pasadena, California, USA
iST is pleased to announce our participation in ISTFA 2025, the premier international symposium and exhibition dedicated to Testing and Failure Analysis, taking place from November 18–19, 2025 in Pasadena, California, USA.
ISTFA is one of the most influential global events for professionals in semiconductor failure analysis, advanced packaging, materials science, and device reliability. It brings together experts worldwide to exchange insights on the latest analytical techniques, emerging technologies, and engineering best practices.
At ISTFA 2025, iST will showcase our comprehensive one-stop capabilities in Failure Analysis, Packaging Validation, Material Analysis, Reliability Testing, and Electrical Characterization, along with our advanced engineering expertise in advanced packaging and heterogeneous integration reliability.
With strong technical depth and global laboratory support, iST enables customers to accelerate root-cause investigation, enhance product reliability, and shorten time-to-market.
★ Date : November 18 (Tue) – November 19 (Wed), 2025
★ Location : Pasadena Convention Center
★ Booth：405
※ Admission is subject to the event organizer’s policies. For details, please visit the ISTFA 2025 official website.
