Date: October 24, 2025 (Friday)
Venue: Japan, Tokyo
iST was once again invited to participate in the 2025 TSMC Japan Open Innovation Platform Ecosystem Forum, joining global experts from wafer foundry, IC design, advanced packaging, and testing sectors to explore the latest developments and innovations shaping the semiconductor ecosystem.
Held in Japan, the forum focused on key topics such as AI, High-Performance Computing, Heterogeneous Integration, and Advanced Packaging, featuring forward-looking technologies and collaborative achievements in design, manufacturing, and system integration.
At the event, iST highlighted its comprehensive one-stop solutions covering Packaging Validation, Material Analysis, Reliability Testing, and Failure Analysis.
With deep expertise in Advanced Packaging and Heterogeneous Integration Reliability, iST supports customers in accelerating package design, optimizing material selection, and reducing time-to-market through an integrated verification platform and multidisciplinary engineering capabilities.
iST sincerely appreciates the opportunity to connect with industry partners and will continue to advance packaging technology and reliability verification with Professionalism, Speed, and Depth.
★ Date : October 24, 2025 (Friday)
★ Location : Grand Hyatt Tokyo
★ Booth No.：#2
※ Admission is subject to the event organizer’s policies. For details, please visit the TSMC official website.