Date：2025/9/16~18
Venue：World Trade Center Grenoble, France
iST is proud to announce our participation in the IEEE EMPC 2025 (European Microelectronics Packaging Conference) in France.
As one of the most influential annual international conferences in the field of microelectronics packaging, EMPC 2025 will take place on September 16–18, 2025, at the World Trade Center Grenoble, France.
This year’s conference focuses on Packaging and System Integration, Materials and Process Optimization, as well as Reliability and Design Development, serving as a key platform for industry collaboration and a forefront hub for technological innovation.
iST will showcase our core expertise in Packaging Verification, Reliability Testing, and Material Analysis, along with integrated solutions designed to address challenges in high-power devices and heterogeneous integration. We look forward to engaging with global partners and jointly exploring the future trends of the semiconductor industry across Europe and Asia.
We sincerely invite you to meet us at EMPC 2025 and join iST in shaping the next chapter of semiconductor packaging and reliability.
★ Date：September 16 (Tue) – September 18 (Thu), 2025
★ Venue：World Trade Center Grenoble, France
★ Booth：#21
※ Admission is subject to the event organizer’s policies. For details, please visit the EMPC 2025 official website.