Date: 5 – 8 December 2023
Location: Grand Copthorne Waterfront Hotel, Singapore
EPTC Conference, the pinnacle of advanced IC packaging technology in Asia, will hold its 25th edition from December 5th to December 8th, 2023, in Singapore. Organized by the IEEE Electronics Packaging Society, this year’s conference adopts a physical forum format, focusing on cutting-edge electronic IC packaging technology. The event encompasses discussions on design, manufacturing, and execution of leading technologies.
This international-level technical forum invites renowned experts and scholars from the industry, academia, research institutions, and international organizations worldwide. iST is honored to present the latest technical paper at EPTC, with Mr. Jeffrey Lee, Assistant Vice President of the International Engineering Development Department, delivering a speech on “A Board Level Vibration Test Method for Electronic Industry Application.”
Additionally, iST will have a Panel booth at EPTC, and we welcome you to join us for discussions.
iST looks forward to exchanging ideas with world-class experts and industry elites, sharing the latest testing technologies, and providing cutting-edge application solutions for the electronic industry supply chain.
We cordially invite professionals and experts from the industry to register and participate in this forum.
Information of iST’s paper:
Session : Reliability and Failure Analysis
Topic : A Board Level Vibration Test Method for Electronic Industry Application
Time : December 8, 2023 (Friday) 11:30am – 11:50am
Speaker : Jeffrey Lee – iST-Integrated Service Technology, Inc.
EPTC website: https://www.eptc-ieee.net/