Home 【Invited Lecture】ECTC 2017

【Invited Lecture】ECTC 2017

Home 【Invited Lecture】ECTC 2017

【Invited Lecture】ECTC 2017

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Date:2017-06-01
Place : Lake Buena Vista, FL, USA

ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE, which is a world-top trade show of IC packaging technology.

The 2017 ECTC will be held at The Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Florida, USA, during May 30 – June 2, 2017. iST has been invited to be one of the speakers at the forum to share its latest verification research.

For more details:http://www.ectc.net/

Information
  • 9:00 AM – 11:00 AM Thursday, June 01, 2017
  • Session 39: Interactive Presentations 3
  • Topic : The Novel Failure Mechanism of the Polymer Ball Interconnected CBGA under Board Level Thermal Mechanical Stress
  • Speaker : Jeffrey Lee – iST-Integrated Service Technology, Inc.