Date: 2024/4/17-20
Place: Toyama International Conference Center (Toyama Prefecture, Japan)
iST had an incredible time showcasing our cutting-edge electronic packaging solutions at the International Conference on Electronic Packaging (ICEP), Japan’s largest electronic packaging technology conference, from April 17th to 20th, 2024. We are honored to have been invited to present an exciting speech at the conference and sincerely thank to everyone who visited our booth and contributed to the vibrant discussions.
We look forward to seeing you soon!
Information of iST’s paper:
Topic: IC Package Board Level Vibration Test for Electronic Industry
Lecturer: Jeffrey Lee, Assistant Vice President
For more information about the exhibition, please visit: https://www.jiep.or.jp/icep/