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Engineering Contacts

  • Failure Analysis
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  • Materail Analysis
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Sample preparation

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SMT Sample Preparation

Cross-section/CP/Grinding

Wafer Saw/COB Bonding

FIB circuit edit
Defect detection
(EMMI/InGaAs/OBIRCH /InSb )
Physical analysis(SEM)
Non-destructive Analysis (OM/SAT/X-ray/3D X-Ray)
Competitive analysis
Electrical characteristics measurement(TDR/Curve Tracer/NanoProbe/TLP)
(TDR/Curve Tracer/NanoProbe/TLP)

Inquiry for IC related & Uncertain cases: +886-3-5799909#8585

Wafer Reliability
Device Reliability

Reflow/Thermal Shock/MSL

EMC(EMI. EMS) 

OLT/Gate Leakage

ESD/Latch up

Board Level Reliability (BLR)
System reliability analysis
  • Please contact DEKRA iST
  • Tel: +886-3-5795766
PCB DESIGN & VERIFICATION
Automotive Electronics
Sample Preparation &Structure Observation

DualBeam FIB/Plasma FIB

TEM/EDX/EELS

Surface & Component Analysis

CAFM/AFM/FTIR /TMA

WLI (OP)/XPS/AES/SIMS

Cable Signal Integrity

HDMI/MHL/DP/USB

Wireless Signal Integrity

OTA:SISO.MIMO

IoT: Wi-Fi

Design Quality Management (DQM)
Chemical Analysis /Consulting Services

Investor Relations / Press Contact

Investor Relations
  • Spokes Person: CFO-Selina Lin
  • Tel: +886-3-5799909#1888
  • Email: ir@istgroup.com
Press Contact