Issued Date: 2019/4/18
Issued By: iST
How to make a wafer as thin as a cicada’s wing?
What is the Taiko Grinding Process?
Since 2018, iST has officially entered into the wafer thinning process service, which is a critical process between the wafer mass production and packaging operation. During this time, we have received many inquiries from customers of how does iST perform the BGBM wafer thinning. The BGBM wafer thinning divided into two paths: non-Taiko grinding and Taiko grinding, and the latter one is the key to make a wafer as thin as a cicada’s wing.
In this iST video – Mr. Tony Liu, the R&D director of iST and a master of surface process engineering, is here to show you the actual operation of the Taiko grinding in wafer thinning process in a video lasting about 3 minutes.