The BGA scope inspects the appearance of BGA joint solder balls from the sides of an IC by an optical refraction of 45° prism.
The Superiority of iST
Broken interface and heavy flux residue between solder ball and package
QFN (leadless) dewetting caused by insufficient solder
An arc interface caused by non-molten solder ball and flux in BGA (ball grid array)
- Magnification：50X ~ 200X
- Suitable for dimension measurement