Home Press Releases iST breaks through the barrier of 10nm in TEM material analysis technology

iST breaks through the barrier of 10nm in TEM material analysis technology

Home Press Releases iST breaks through the barrier of 10nm in TEM material analysis technology

iST breaks through the barrier of 10nm in TEM material analysis technology

by ruby

Issued Date: 2015/7/10
Issued By: iST

Keeping up with the semiconductor industry’s development in more advanced process, iST makes another breakthrough in Material Analysis! After a whole year of hard work, it now owns the testing technique required by the 10nm process this year. In addition to assisting clients in TEM analysis and verification in their advanced process, technology capacity of iST is being recognized by the International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), one of the leaders in the IEEE semiconductor components failure analysis field, as it is invited to present paper in the meeting.

Leading brands are accelerating their development in advanced process to meet demands from smart devices for semiconductor components of better performance, lower power consumption, and reduced dimension, according to iST. From 20nm last year and 14nm this year, Semiconductor plants  are planning for mass production of components of 10nm or even smaller in next year. That is, booming TEM analysis requirements across the whole supply chain.

iST further noted, with the most powerful TEM equipment for EDS elements analysis in domestic industry installed last year, employment of multiple TEM experts with PhDs, Dr. Bao Zhongxing, one of the top domestic TEM authorities, and a full year of hard work, iST is not only expanding its capacity in big steps but also pushing its testing and analysis ability from 14nm last year to 10nm process. Thanks to scores of customers’ acceptance, including LED epitaxial plants, semiconductor plants and foundries, iST is enjoying full capacity utilization as well as planning for more expansion in second half of this year to meet customer needs.

Dr. Sheng-Yu Chen, Manager in Material Analysis Engineering Department of iST, pointed out the company’s material analysis technology is not only widely known but also recognized by IPFA. iST is to present a poster “Highly accurate TEM/EDS analysis to identify the stack oxide-nitride-oxide structure of advanced NAND flash products.” In IPFA held this month. This technology may be applied in analyzing dielectric layer material in advanced semiconductor production process.

Both are presented in the 2015 IEEE forum.

TEM image of the latest vertical stack flash memory (V-NAND) by leading South Korea brand.

TEM/EDS analysis results of undamaged memory unit.

The dielectric layer materials employed by advanced process are vulnerable to damages in analysis and hard to get successful analysis outcomes, noted Dr. Chen. With industry leading TEM/EDS equipment and fully optimized experiment parameters, iST is capable of fast signal gathering and accurate element distribution information before the dielectric layer material is damaged. This equips R&D engineers with the best supports in process improvements and it is the unique factor that establishes iST as the best partner for customers in raising development competitiveness at the product R&D stage.

About Integrated Service Technology

Founded in 1994, iST began its business from IC circuit debugging and modification and gradually expanded its scope of operations, including failure analysis, reliability verification, material analysis and so on. iST has offered full-scope verification and analysis services to the IC engineering industry, its customers cover the whole spectrum of the electronics industry from IC design to end products.

In response to rising Cloud Intelligence, Internet of Things (IoT) and Internet of Vehicles (IoV), iST not only focuses on its core services but is also expanding its service offerings based on international trends, such as LED and Automotive electronic verification platforms and high-speed signal transmission integrity services.

iST’s pursuit of precision, perfection and efficiency, which has been accredited by multiple international well-known and credible organizations including IEC/IECQ, TAF, TUV NORD, BSI and CNAS. With increased outsourcing by major international brands, iST also plays the role of independent quality testing laboratory for OBM outsourcing products and association and is certified by TI, Lenovo, Dell, Cisco, Delphi, Continental Automotive, ISTA, HDMI, etc.

On July 2015, iST and DEKRA built a joint venture, Dekra IST to provide services including LED, PCB, PCBA, and system reliability verification, which could help to strengthen both parties’ capabilities of providing first-class testing and certification services in fields of automotive, LED and medical electronics.

Headquartered in Hsinchu, iST has led it to expand its operations around the world. The iST Group now includes iST Kunshan, iST Shanghai, iST Beijing, iST Shenzhen, iST Wuhan and iST Chengdu in China; IC Service in Japan, and an iST laboratory in the US. These are all dedicated to providing customers with prompt, reliable and high-quality technical services in order to grow with the leaders of the world. For more information, please visit the iST website at:www.istgroup.com