Date：2016/8/18
Place：Wuhan, China
The 17th International Conference on Electronic Packaging Technology (ICEPT) will be held in Wuhan, China on 16-19 August. This year, Jeffrey Lee, Assistant Vice President in Global Engineering Development Division will present a paper entitled “The Failure Mechanism Investigation of the Polymer Ball Interconnected CBGA under Board Level Thermal Mechanical Stress”. Welcome your participation. The information of presentation shows as below.
Information
- Date： Thursday, August 18, 2016
- Time： 09:50AM ~ 10:50AM
- Venue Room： Conference Hall
- Topic： The Failure Mechanism Investigation of the Polymer Ball Interconnected CBGA under Board Level Thermal Mechanical Stress
- Presenter： Jeffrey Lee
iST-Integrated Service Technology, TW
For more detail, please refer to the following link
About ICEPT
The Chinese semiconductor industry was initiated by the “12-Year Plan for Scientific and Technological Development” in 1956. With more than 50 years of progress, China has formed a complete industry chain incorporating all three sectors of the semiconductor industry: IC design, manufacturing, packaging and testing. China’s semiconductor industry achieved revenue of 404.45 billion RMB in 2013, which accounted for 38.3% of the China semiconductor market and reached a record of 21.4% of the global market.
In the last decade, China’s semiconductor industry is on the rapid growth. Chinese packaging and testing companies number has been increasing to more than 300 at present, boosted from around 70 in 2001, and they dominate approximately 50% of the revenue of the semiconductor industry. In the field of advanced packaging technologies (such as SiP, 2.5D interposer, 3D IC, TSV interconnect, WLCSP and R&D on packaging related material and equipment), China is narrowing the technology gap rapidly and has accumulated distinct advantage in term of technique and industry.
However, several disadvantages still exist in the field of packaging in China. This includes an incomplete innovation system, few influential achievements, inadequate planning and a lack of sense of competition. As wafer fabrication enters into a “post-moore era”, the development of packaging technology faces more challenges to satisfy the market demand for low cost, small size, high speed, high density and high performance, while also providing opportunities to lead the field.