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IC Backside Polishing
 
 

Principle:
From the chip backside, mill the Si substrate to a specified thickness with automatic milling machine, before performing polishing. The main purpose is to enable the following EMMI or OBITCH analysis to be performed through the chip backside.

Applications:
Pre-treatment for Backside EMMI / OBIRCH analysis

IC
 
Backside milling of general IC 
 
Backside milling of COB sample
 
Backside OBIRCH image
backside、backside polishing、backside lapping
吳先生/Puma
+886-3-5799909#6731
web_decap@istgroup.com
Please contact nearest location for inquiries :
USA Taiwan ─ Hsinchu China ─ Shanghai Kunshan Beijing Shenzhen Japan
Other services you may be interested in:
 
FIB Circuit Edit
Emission Microscopy (EMMI)
InGaAs EMMI
Optical Beam Induced Resistance Change (OBIRCH)
Backside FIB Circuit Edit
 


 
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