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IC Wire Bonding Service
 

A die must be linked with the substrate mechanism to fulfill its intended function; a wire bonding is to connect the signal from a die to the substrate. iST provides the following services:

Wire bonding for Ceramic Packing (Fig.1)-->Ceramic Packing list
Driver IC Bonding(Fig.2)
COB Bonding (Fig.3)
FIB (PT) pad Bonding (Fig.4)
Die-to-die Bonding (Fig.5)
Stud Bumping
Rebonding
Bonding modification (Fig.6)
Post bonding tests (Open/Short test)
 
Equipment:

Model Wire Range Maximum Wire Length Total Bond Placement Accuracy Bonding Area Bond Force
Kns
Maxum
(Ball Bonding)
Au wire 7.6 mm(0.3in) ±3.5um  X Axis 56mm
Y Axis 66mm
(2.2 X 2.6 in)
Minimum:5 grams
Maximum:300 grams
Kns
Maxum Ultra
(Ball Bonding)
Au wire 7.6 mm(0.3in) ±2.5um  X Axis 56mm
Y Axis 66mm
(2.2 X 2.6 in)
Minimum:5 grams
Maximum:300 grams
Resolution:1 grams
Kns
IConn
(Ball Binding)
Au wire 7.6 mm(0.3in) ±2.0um  X Axis 56mm
Y Axis 80mm
(2.2 X 3.15 in)
Minimum:3 grams
Maximum:1000 grams
Resolution:0.17 grams
Kns
IConn Plus
(Ball Bonding &
Wedge Bonding)
Au、Al wire 7.6 mm(0.3in) ±2.0um  X Axis 56mm
Y Axis 80mm
(2.2 X 3.15 in)
Minimum:3 grams
Maximum:1000 grams
Resolution:0.17 grams
Westbond
(Wedge bonding)
Au、Al wire NA NA NA NA


iST provides multiple bonding method to meet customer needs:

Wedge to Wedge: Both the first and second bonds are wedge bonds, direction of bonding is parallel to pads; aluminum (Al) wire is normally used. (Fig.7)
Ball to Wedge: A ball bond at the first connection and a wedge bond at the second connection. The bonding wire takes the center of the ball bond as the center of its placement. Mainly bonded with Au wires (Fig.8) 
Stud Bumping: Planting a ball on a solder pad, mainly bonded with Au wires (Fig.9)

Besides the above services, iST also provides professional consultation and/or solutions for all packaging and bonding issues.

Example photo
 
 Ceramic packaging(Fig. 1)
Example photo
 
 Driver IC Bonding(Fig. 2)
 
Example photo                                                                              
 
 COB Bonding(Fig. 3)
 
 COB Bonding(Fig. 3)
 
 FIB(PT) pad Bonding(Fig. 4)
Example photo
 
 Die-to-die bonding(Fig. 5)
Example photo
 
 Die-to-die bonding(Fig. 5)
 
Example photo
  Bonding modification(Fig. 6)
 Bonding modification(Fig. 6)
 
 Bonding modification(Fig. 6)

Example photo
 
 Wedge to Wedge(Fig. 7)
Example photo
 
 Ball to Wedge(Fig. 8)
 

Example photo
 
 Stud Bumping(Fig. 9)
Example photo
 Stud Bumping(Fig. 9)
 
wire bonding、bonding、COB
楊先生/Benson
+886-3-5799909#6862
web_ass@istgroup.com
Please contact nearest location for inquiries :
USA Taiwan ─ Hsinchu China ─ Shanghai Kunshan Beijing Shenzhen Japan
Other services you may be interested in:
 
Wafer Dicing Service
IC Packaging and Integration
Keithley Parameter Analyzer
Auto Curve Tracer
HP4156 Parameter Analyzer
Time Domain Reflectometer (TDR)
 


 
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