Home Tech Library How to assemble biomedical chips now rooted in leading IC manufacturers?

How to assemble biomedical chips now rooted in leading IC manufacturers?

Home Tech Library How to assemble biomedical chips now rooted in leading IC manufacturers?

How to assemble biomedical chips now rooted in leading IC manufacturers?

by ruby

Issued Date: 2017/11/30
Issued By: iST

Though it looks unfamiliar with the IC industry, “biomedicine” may be part of the next era of semiconductor manufacturing together with the Moore’s Law breakthrough and advanced process pursuance.

The iST Tech Classroom is aimed to review biomedical chips—the new blue ocean market which, in spite of seeming unpopular among the general, has been worked upon by leading IC manufacturers for quite some time.

The contemporary semiconductor industry has been fast growing for decades. We all know about the trend of leaving consumer electronics behind and stepping into IoT and automotive ones, yet biomedicine industry?

The Quick Assembly Lab, one of the key units of iST, behind the curtain of verification and analysis platforms, has been assisting clients in wire bonding and assembling their engineering samples at the experimental stage to later facilitate ESD/OLT analysis and testing. The lab has made up to 100 thousand packaging cases since its foundation 17 years ago, and we experienced a clear shift of IC chips into the biomedicine industry in the last five years.

A couple of leading international semiconductor makers have been commissioning iST for up to 1000 “biomedical chip” engineering sample assembly in preparation for the emerging biomedicine blue ocean markets.

Take R&D. Differing from advanced process focused by IC chips the biomedicine ones are targeting accuracy and sensing mandated by medical diagnosis, cancer screening, and new drug identification. This has resulted in biomedical chips’ R&D with existing process equipment by many semiconductor makers.

On the other hand, both biomedical and IC ships mandate comprehensive debugging and validation. That is, the key is the pre-verification assembly. In addition to tiered electric tests required by IC chips during R&D, the biomedical chips have to go through contact tests for detection accuracy verification by blood and special solutions, etc. All these require IC sample assembly in advance.

There is one more point worthy of attention. The assembly of biomedical chips mandates special treatment, instead of the simple protection function needed by IC ones, due to their particular usage. That is, the chemical resistance of assembly materials are critical as most R&D and test of biomedical chips may involve dripping different solvents and solutions in the sensor area on the chip surface.

Let’s see how iST is assembling biomedical chips before sample tests!

See figure on the right illustrating cross-section of chip assembly.
Assembling with glass?
Keep viewing for more…

  • Step 1

    Most biomedical chips may be subject to R&D test by contact-type solution drops. Glass, being more acid and alkaline resistant, is employed instead of ordinary assembling materials due to poor corrosion protection.

    iST will work with clients to customize the slotting of glass (see figure on the right) by identifying the dripping position on the IC chip (most likely where the sensor is placed).

  • Step 2

    Subject chips to sample preparation and wire bonding and assembling; see figure on the right for ceramic chips packed with LCC material.

  • Step 3

    Insert the IC sample for test of step 2 in an electric test board for gluing and bonding with custom slotted glass plate made in step 1. The biomedical chip is now assembled and ready for testing.

Step 1

Most biomedical chips may be subject to R&D test by contact-type solution drops. Glass, being more acid and alkaline resistant, is employed instead of ordinary assembling materials due to poor corrosion protection.

iST will work with clients to customize the slotting of glass (see figure on the right) by identifying the dripping position on the IC chip (most likely where the sensor is placed).

Step 2

Subject chips to sample preparation and wire bonding and assembling; see figure on the right for ceramic chips packed with LCC material.

Step 3

Insert the IC sample for test of step 2 in an electric test board for gluing and bonding with custom slotted glass plate made in step 1. The biomedical chip is now assembled and ready for testing.

We are glad to have your long-lasting support and to share our experience with you. We are more than glad to service you with any engineering sample or customized assembling requirements, other than biomedical chips, or provide you with more detailed and relevant information. Just call Peter at +886-3-579-9909 Ext. 6861 or email him at ist_assy@istgroup.com

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